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Tin electrodeposition from sulfate solution containing a benzimidazolone derivative

Said Bakkali, Abdelillah Benabida, Mohammed Cherkaoui

Abstract


Tin electrodeposition in an acidic medium in the presence of N,N’-1,3-bis-[N-3-(6-deoxy-3-O-methyl-D-glucopyranose-6-yl)-2-oxobenzimidazol-1-yl)]-2-tetradecyloxypropane as an additive was investigated in this work. The adequate current density and the appropriate additive concentration were determined by gravimetric measurements. Chronopotentiometric curves showed that the presence of the additive caused an increase in the overpotential of tin reduction. The investigations by cyclic voltammetry technique revealed that, in the presence and in absence of the additive, there were two peaks, one in the cathodic side attributed to the reduction of Sn2+ and the other one in the anodic side assigned to the oxidation of tin previously formed during the cathodic scan. The surface morphology of the tin deposits was studied by scanning electron microscopy (SEM) and XRD.


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- J. M. Bureka, A. S. Budiman, Z. Jahed, N. Tamura, M. Kunz, S. Jin, S. Min J. Han, G. Lee, C. Zamecnik, T. Y. Tsui, Materials Science and Engineering, 2011, A528, 5822-5832.

- F. Wanga, L. Chen, C. Deng, H. Ye, X. Jiang, Ga. Yang Electrochimica Acta 2014, 149, 330-336.

- K. Zhuo, Myung-Gi Jeong, C-Hwa Chung Journal of Power Sources, 2013, 244, 601-605.

- D. T. Mackay, M. T. Janish, U. Sahaym, P. G. Kotula, K. L. Jungjohann, C. B. Carter, M. G. Norton Journal of Materials Science, 2014, 49, 1476-1483.

- N. Kaneko, N.Shinohara, H. Nezu, Electrochem. Acta, 1992, 37, 2403-2409.

- Y. Nakamura, N.Kaneko, H.Nezu, Journal of Applied Electrochemistry, 1994, 24, 569-574.

- N. Dohi, Journal of the Metal Finishing Society of Japan, 1970, 21, 240.

- M. Clarke, S. C. Britton, Transactions of the Institute of Metal Finishing, 1962, 39, 5.

- M. Clarke, J. A. Bernie, Electrochimca. Acta, 1967, 12, 205.

- S. Bakkali, T. Jazouli M. Cherkaoui, M. Ebntouhami, N. El Hajjaji., E. Chassaing Plating and Surface finishing, 2003, 90, 46- 49.

- B.Lakhrissi, L.Lakhrissi, M.Massoui, E.M.Essassi, F.Comelles, J.Esquena, C.Solans, C.Rodrýiguez-Abreu, Journal of Surfactants and Detergents, 2010, 13, 329-338.

- S. Bakkali, R. Touir, M. Cherkaoui, M. Ebn Touhami Surface & Coatings Technology 2015, 261, 337-343.

-M. Charrouf, S.Bakkali, M.Cherkaoui, M. EL Amrani, Journal of the Serbian Chemical Society. 2006, 71(6), 661-668.

- S. Bakkali, M. Charrouf, M. Cherkaoui, Physical and Chemical News, 2005, 25, 110-117.

- S.Bakkali, M. Cherkaoui, M. Belfaquir, ScienceLib Editions Mersenne, juillet 2013, 5, 130705, 1-13.

- S. Tzeng, S. H. Lin, Y. Y. W a n g , C. C. W a n, J o u r n a l o f a p p l i e d e l e c t r o ch e m i s t r y 1996, 26, 419-423.

- J. O'M Bockris and K. N. Reddy, 'Modern Electrochemistry', Vol. 2, Plenum, New York, 1975, 969.

- J Long, Z. Zhang, ZC Guo, X.Y. Zhu, H. Huang Advanced Materials Research, 2012, 460, 7-10.

- I. Petersson, E. Ahlberg Journal of Electroanalytical Chemistry, 2000, 485, 166-177.

- A.M. I. Magdy, M. A. O. Enam, Surface & Coatings Technology, 2013, 226, 7-16.

- H. M.A. Soliman Applied Surface Science, 2002, 195, 155-165.

- N.P. Clark, E. Jakson, M. Robinson, British Corrosion Journal. 1979,14, 33.

- Lj. M. Vracar, D.M. Drazic Corrosion Science, 2002, 44, 1669-1680.

- J.Y. Lee, JW Kim, MK Lee J Electrochem Soc, 2004, 151, 25-25.

- G Trejo, H Ruiz, R OrtegeBorges et al J Appl Electrochem, 2001, 31, 685.

- DS Baik, DJ Fray J Appl Electrochem., 2001, 31, 1141.

- K.S. Kim, C.H. Yu, J.M. Yang, Microelectronics Reliability, 2006, 46, (7), 1080-1086.

- A. Dilawar, M.Z. Butt, I. Muneer, F. Bashir, M. Saleem, International Journal for Light and Electron Optics, 2017, 128, January, 235-246.

- P. Eckold, R. Niewa, and W. Hügel, Microelectronics Reliability, 2014, 54, (11), 2578-2585.




DOI: http://dx.doi.org/10.13171/mjc61/01611211149/bakkali

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